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dc.contributor.authorCheng, H. W.en_US
dc.contributor.authorHsieh, E. R.en_US
dc.contributor.authorHuang, Z. H.en_US
dc.contributor.authorChuang, C. H.en_US
dc.contributor.authorChen, C. H.en_US
dc.contributor.authorLi, F. L.en_US
dc.contributor.authorLo, Y. M.en_US
dc.contributor.authorLiu, C. H.en_US
dc.contributor.authorChung, Steve S.en_US
dc.date.accessioned2019-04-02T06:04:26Z-
dc.date.available2019-04-02T06:04:26Z-
dc.date.issued2018-01-01en_US
dc.identifier.issn1930-8868en_US
dc.identifier.urihttp://hdl.handle.net/11536/150748-
dc.description.abstractA novel concept of OTP has been demonstrated to create another feasibility to allow re-writable capability before storing the data. This OTP is named ReWritable One-time programming (RW-OTP) memory. With RW-OTP, users can do the test by modifying the contexts repeatedly before finalizing the stored data. To implement the memory cell, it consists of a gate-floated FinFET and an RRAM where a bilayer has been designed as a thicker dielectric layer with resistive-switching property on a thinner dielectric-fuse layer. Moreover, the process of RW-OTP is fully compatible with the state-of-the-art CMOS logic technology. The result shows that the memory cell exhibits high retention and good endurance. With proper use of RW-OTP, the users can not only reduce error jobs cost-efficiently but also can develop various applications for their needs. This memory cell is very promising for embedded applications.en_US
dc.language.isoen_USen_US
dc.titleA Novel ReWritable One-Time-Programming OTP (RW-OTP) Realized by Dielectric-fuse RRAM Devices Featuring Ultra-High Reliable Retention and Good Endurance for Embedded Applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2018 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000444900700038en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper