Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chen, Kuan-Neng	en_US
dc.date.accessioned	2019-04-02T06:04:16Z	-
dc.date.available	2019-04-02T06:04:16Z	-
dc.date.issued	2018-01-01	en_US
dc.identifier.uri	http://hdl.handle.net/11536/151067	-
dc.language.iso	en_US	en_US
dc.title	Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)	en_US
dc.citation.spage	79	en_US
dc.citation.epage	79	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000458919700023	en_US
dc.citation.woscount	0	en_US
顯示於類別：	會議論文