標題: | PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE |
作者: | Chien-Chung Lin Hao-Chung Kuo Chin-Wei Sher Hau-Vei Han Kuo-Ju Chen Zong-Yi Tu Hsien-Hao Tu |
公開日期: | 9-Feb-2017 |
摘要: | A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer. |
官方說明文件#: | H01L023/535 H01L021/768 H01L023/532 |
URI: | http://hdl.handle.net/11536/151251 |
專利國: | USA |
專利號碼: | 20170040262 |
Appears in Collections: | Patents |
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