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dc.contributor.authorHung-Wei Yuen_US
dc.contributor.authorYi Changen_US
dc.contributor.authorTsun-Ming Wangen_US
dc.date.accessioned2019-04-11T06:20:37Z-
dc.date.available2019-04-11T06:20:37Z-
dc.date.issued2019-01-03en_US
dc.identifier.govdocH01L021/02en_US
dc.identifier.govdocH01L029/205en_US
dc.identifier.govdocH01L029/10en_US
dc.identifier.govdocH01L029/778en_US
dc.identifier.urihttp://hdl.handle.net/11536/151501-
dc.description.abstractMethods and structures includes providing a substrate, forming a prelayer over a substrate, forming a barrier layer over the prelayer, and forming a channel layer over the barrier layer. Forming the prelayer may include growing the prelayer at a graded temperature. Forming the barrier layer is such that the barrier layer may include GaAs or InGaAs. Forming the channel layer is such that the channel layer may include InAs or an Sb-based heterostructure. Thereby structures are formed.en_US
dc.language.isoen_USen_US
dc.titleEpitaxies of a Chemical Compound Semiconductoren_US
dc.typePatentsen_US
dc.citation.patentcountryUSAen_US
dc.citation.patentnumber20190006173en_US
Appears in Collections:Patents


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