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dc.contributor.authorJheng, Li-Chengen_US
dc.contributor.authorHsiao, Chi-Huien_US
dc.contributor.authorKo, Wen-Chingen_US
dc.contributor.authorHsu, Steve Lien-Chungen_US
dc.contributor.authorHuang, Yu-Lunen_US
dc.date.accessioned2019-05-02T00:25:54Z-
dc.date.available2019-05-02T00:25:54Z-
dc.date.issued2019-06-07en_US
dc.identifier.issn0957-4484en_US
dc.identifier.urihttp://dx.doi.org/10.1088/1361-6528/ab0483en_US
dc.identifier.urihttp://hdl.handle.net/11536/151633-
dc.description.abstractA variety of conductive films made of a hybrid of two conductive nanomaterials have been used as stretchable electrodes or interconnectors, desirable for stretchable electronic devices. Their intrinsic stretchability of electrical conductivity allows for accommodating mechanical strain to a certain extent under various deformations. However, few efforts have been made to enhance the interactions between two conductive components in a hybrid system. Herein, we reported new conductive films with tri-layer sandwich structures based on carbon nanotubes (CNTs) and Ag nanowires (NWs), encapsulated in silicone rubber, exhibited high stretchability along with insignificant piezoresistivity. They are suitable to be stretchable interconnectors. A successive vacuum filtration method was used to stack the conductive components layer by layer. The effects of the stacking sequence and the interactions between layers on the stretchability and stability of the electrical properties under mechanical deformations were studied. In the case of a tri-layer conductive film comprising two CNT outer layers and one AgNW central layer in the presence of enhanced interfacial interactions, it showed exceptionally durability in withstanding repetitive deformations.en_US
dc.language.isoen_USen_US
dc.subjectstretchable electronicsen_US
dc.subjectsilver nanowiresen_US
dc.subjectcarbon nanotubesen_US
dc.subjecthybriden_US
dc.subjectsandwich structureen_US
dc.titleConductive films based on sandwich structures of carbon nanotubes/silver nanowires for stretchable interconnectsen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/1361-6528/ab0483en_US
dc.identifier.journalNANOTECHNOLOGYen_US
dc.citation.volume30en_US
dc.citation.issue23en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000462496700001en_US
dc.citation.woscount0en_US
Appears in Collections:Articles