完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Liao, Chia-Chun | en_US |
dc.contributor.author | Lin, Min-Chen | en_US |
dc.contributor.author | Liu, Shao-Xuan | en_US |
dc.contributor.author | Chao, Tien-Sheng | en_US |
dc.date.accessioned | 2014-12-08T15:21:25Z | - |
dc.date.available | 2014-12-08T15:21:25Z | - |
dc.date.issued | 2012-02-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/LED.2011.2174609 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/15237 | - |
dc.description.abstract | This letter investigates the impacts of proximity layers on metal-induced lateral crystallization (MILC). The underlying insulating layers not only affect the MILC growth length but also influence the electrical characteristics. Based on the comparison among the underlying insulating layers, SiN is unsuitable to be an underlying insulating layer because of concerns regarding the crystallization condition. This letter proposes three reasonable mechanisms, including the gettering of Ni, intrinsic stress, and the involvement of hydrogen to enhance the understanding of the impacts of proximity layers. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Metal-induced lateral crystallization (MILC) | en_US |
dc.subject | strain | en_US |
dc.subject | thin-film transistors (TFTs) | en_US |
dc.title | Impacts of the Underlying Insulating Layers on the MILC Growth Length and Electrical Characteristics | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/LED.2011.2174609 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 33 | en_US |
dc.citation.issue | 2 | en_US |
dc.citation.spage | 239 | en_US |
dc.citation.epage | 241 | en_US |
dc.contributor.department | 電子物理學系 | zh_TW |
dc.contributor.department | Department of Electrophysics | en_US |
dc.identifier.wosnumber | WOS:000299812300037 | - |
dc.citation.woscount | 1 | - |
顯示於類別: | 期刊論文 |