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dc.contributor.authorSu, P. C.en_US
dc.contributor.authorJiang, C. M.en_US
dc.contributor.authorWang, C. W.en_US
dc.contributor.authorWang, Tahuien_US
dc.date.accessioned2019-08-02T02:24:17Z-
dc.date.available2019-08-02T02:24:17Z-
dc.date.issued2018-01-01en_US
dc.identifier.isbn978-1-5386-5479-8en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://hdl.handle.net/11536/152441-
dc.description.abstractThe relationship between SET-state current level and read-disturb failure time in a tungsten oxide RRAM is characterized and modeled. Our result shows that read voltage induced reduction of oxygen vacancy density in tungsten oxide follows a power law dependence on cumulative read-disturb time. The power factor is independent of SET-state current level. Read disturb failure time is considerably improved by several orders of magnitude as SET-state current level increases a few times. An analytical model to correlate SET-state current level and read disturb failure time is proposed. Since SET-state current level is related to a cross-section of a conductive filament in an oxide, our model is developed based on a relationship between oxide area and critical oxide trap (oxygen vacancy) density from an oxide breakdown model. The validity of the proposed model is supported by experiment results.en_US
dc.language.isoen_USen_US
dc.subjectRRAMen_US
dc.subjectread-disturb failureen_US
dc.subjectSET-state current levelen_US
dc.subjectmodelen_US
dc.titleCorrelation between SET-State Current Level and Read Disturb Failure Time in a Resistive Switching Memoryen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000468959600135en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper