標題: Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation
作者: Lin, Tingyou
Su, Chauchin
Hung, Chung-Chih
Nidhi, Karuna
Tu, Chily
Huang, Shao-Chang
交大名義發表
電信工程研究所
National Chiao Tung University
Institute of Communications Engineering
關鍵字: accelerated aging;accelerated testing;power MOSFET
公開日期: 1-一月-2019
摘要: This paper investigates power MOSFET stress strategies for both package and chip aging evaluation. Two stress test methods are developed to speed up packaging and chip aging process respectively. As a result, the characteristics shifts of package and chip aging can be plotted independently. Thus, the measurement accuracy and measurement time can be improved. A test chip is designed and fabricated in a 0.15tm BCD process. The measured results demonstrate a 10kjtm power MOSFET has R-on increased by 72% after 6.3hr stress for the package aging. For the chip aging, the MOSFET has R-on increased by 12% after 600 times stress pulses. The measurement verifies that the accelerated aging in the package and the chip can be controlled separately.
URI: http://hdl.handle.net/11536/152480
ISBN: 978-3-9819263-2-3
ISSN: 1530-1591
期刊: 2019 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE)
起始頁: 1661
結束頁: 1666
顯示於類別:會議論文