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dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorSyu, Yong-Enen_US
dc.contributor.authorChuang, Siang-Lanen_US
dc.contributor.authorLi, Cheng-Huaen_US
dc.contributor.authorGan, Der-Shinen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2014-12-08T15:21:32Z-
dc.date.available2014-12-08T15:21:32Z-
dc.date.issued2012en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/15300-
dc.identifier.urihttp://dx.doi.org/10.1149/2.013203eslen_US
dc.description.abstractTraditionally, a large number of silicon oxide materials are extensively used as various dielectrics for semiconductor industries. But silicon oxide cannot be used as resistance random access memory (RRAM) due to its native electrical properties. In this work, based on the concept of inducing defect by metal doping into insulator, silicon oxide with a few tin dopants at room temperature can successfully be used as switching layer in RRAM. According to electrical analyses, the current transport mechanism in Sn-doped silicon oxide is governed by Pool-Frenkel emission, which demonstrates the conduction path in the RRAM guided by Sn doping induced defect. (C) 2011 The Electrochemical Society. [DOI: 10.1149/2.013203esl] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleThe Effect of Silicon Oxide Based RRAM with Tin Dopingen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.013203eslen_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume15en_US
dc.citation.issue3en_US
dc.citation.spageH65en_US
dc.citation.epageH68en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000299123400017-
dc.citation.woscount30-
Appears in Collections:Articles