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dc.contributor.authorChen, Chihen_US
dc.contributor.authorJuang, Jing-Yeen_US
dc.contributor.authorChang, Shih Yangen_US
dc.contributor.authorShie, Kai Chengen_US
dc.contributor.authorLi, Yu Jinen_US
dc.contributor.authorTu, K. N.en_US
dc.date.accessioned2019-12-13T01:12:49Z-
dc.date.available2019-12-13T01:12:49Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-4-904743-07-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/153258-
dc.description.abstractIn this study, a low temperature diffusion bonding enabled by (111) highly oriented nanotwinned Cu (nt-Cu) was proposed. Two different bonding atmospheres, one is in IOW vacuum bonding, and another is in N-2 bonding were carried out. Both of the two bonding atmospheres show good bonding interfaces after microstructure observation. For vacuum ambient, large-grained structure was found after 250 degrees C for 90 min at 1 MPa in vacuum bonding. The size was as large as 40 mu m in width and 10 mu m in height. For non-vacuum conditions, the nt-Cu bumps can be bonded to nt-Cu films at the 250 degrees C for 20 min under 40.6 MPa. Accordingly, it is believed that low temperature bonding in low vacuum or non-vacuum ambients can be accomplished by using highly (111)-oriented nt-Cu.en_US
dc.language.isoen_USen_US
dc.titleLow-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cuen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)en_US
dc.citation.spage38en_US
dc.citation.epage38en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000492018300038en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper