Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chen, Chih | en_US |
dc.contributor.author | Juang, Jing-Ye | en_US |
dc.contributor.author | Chang, Shih Yang | en_US |
dc.contributor.author | Shie, Kai Cheng | en_US |
dc.contributor.author | Li, Yu Jin | en_US |
dc.contributor.author | Tu, K. N. | en_US |
dc.date.accessioned | 2019-12-13T01:12:49Z | - |
dc.date.available | 2019-12-13T01:12:49Z | - |
dc.date.issued | 2019-01-01 | en_US |
dc.identifier.isbn | 978-4-904743-07-2 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/153258 | - |
dc.description.abstract | In this study, a low temperature diffusion bonding enabled by (111) highly oriented nanotwinned Cu (nt-Cu) was proposed. Two different bonding atmospheres, one is in IOW vacuum bonding, and another is in N-2 bonding were carried out. Both of the two bonding atmospheres show good bonding interfaces after microstructure observation. For vacuum ambient, large-grained structure was found after 250 degrees C for 90 min at 1 MPa in vacuum bonding. The size was as large as 40 mu m in width and 10 mu m in height. For non-vacuum conditions, the nt-Cu bumps can be bonded to nt-Cu films at the 250 degrees C for 20 min under 40.6 MPa. Accordingly, it is believed that low temperature bonding in low vacuum or non-vacuum ambients can be accomplished by using highly (111)-oriented nt-Cu. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | en_US |
dc.citation.spage | 38 | en_US |
dc.citation.epage | 38 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000492018300038 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |