Low temperature Au-Au direct bonding with highly < 111 >-oriented Au films

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DC 欄位	值	語言
dc.contributor.author	Hsu, Wei-You	en_US
dc.contributor.author	Wu, John	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2019-12-13T01:12:49Z	-
dc.date.available	2019-12-13T01:12:49Z	-
dc.date.issued	2019-01-01	en_US
dc.identifier.isbn	978-4-904743-07-2	en_US
dc.identifier.uri	http://hdl.handle.net/11536/153261	-
dc.description.abstract	In this study, a bonding process with highly < 111 > oriented nano-twined Au (nt-Au) was proposed. A less void bonding interface was observed and it reveals a good bonding quality for the bonded samples. In addition, the Au grains can grow across original interface. All of the above make we suggest Au-Au direct bonding have high strength and durable bonding structure.	en_US
dc.language.iso	en_US	en_US
dc.title	Low temperature Au-Au direct bonding with highly < 111 >-oriented Au films	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)	en_US
dc.citation.spage	52	en_US
dc.citation.epage	52	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000492018300052	en_US
dc.citation.woscount	0	en_US
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