Low temperature polyimide-to-polyimide direct bonding

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Liu, Hong-Che	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2019-12-13T01:12:49Z	-
dc.date.available	2019-12-13T01:12:49Z	-
dc.date.issued	2019-01-01	en_US
dc.identifier.isbn	978-4-904743-07-2	en_US
dc.identifier.uri	http://hdl.handle.net/11536/153262	-
dc.description.abstract	In this study, two polyimide (PI) films were bonded at 250/300 degrees C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..	en_US
dc.language.iso	en_US	en_US
dc.title	Low temperature polyimide-to-polyimide direct bonding	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)	en_US
dc.citation.spage	75	en_US
dc.citation.epage	75	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000492018300075	en_US
dc.citation.woscount	0	en_US
顯示於類別：	會議論文