Low temperature polyimide-to-polyimide direct bonding

Title:	Low temperature polyimide-to-polyimide direct bonding
Authors:	Liu, Hong-Che Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering
Issue Date:	1-Jan-2019
Abstract:	In this study, two polyimide (PI) films were bonded at 250/300 degrees C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..
URI:	http://hdl.handle.net/11536/153262
ISBN:	978-4-904743-07-2
Journal:	PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)
Begin Page:	75
End Page:	75
Appears in Collections:	Conferences Paper