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dc.contributor.authorHuang, J. W.en_US
dc.contributor.authorShie, K. C.en_US
dc.contributor.authorLiu, H. C.en_US
dc.contributor.authorLi, Y. J.en_US
dc.contributor.authorCheng, H. Y.en_US
dc.contributor.authorChen, C.en_US
dc.date.accessioned2019-12-13T01:12:53Z-
dc.date.available2019-12-13T01:12:53Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-4-9902-1887-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/153311-
dc.description.abstractCopper-to-copper direct bonding emerges to be the most important technique for fine pitch packaging in microelectronic devices. Low temperature Cu-to-Cu direct bonding by using highly (111)-oriented nanotwinned Cu (nt-Cu) has been achieved because Cu (111) surface has higher surface diffusiyities. To investigate the bonding effect by using different surface ratio nt-Cu, electroplating under different conditions was performed. The results indicate that bonding with higher (111)-surface ratio copper films would obtain a higher bonding strength of 15% w hen bonding at 300 degrees C.en_US
dc.language.isoen_USen_US
dc.subjectnanotwinned copperen_US
dc.subject(111)-surface ratioen_US
dc.subjectcopper-to-copper direct bondingen_US
dc.titleCopper-to-copper direct bonding using different (111) surface ratios of nanotwinned copper filmsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)en_US
dc.citation.spage52en_US
dc.citation.epage55en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000491362200011en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper