標題: | Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient |
作者: | Juang, Jing-Ye Lu, Chia-Ling Chen, Kuan-Ju Chen, Chao-Chang A. Hsu, Po-Ning Chen, Chih Tu, K. N. 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 17-九月-2018 |
摘要: | A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 degrees C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed. |
URI: | http://dx.doi.org/10.1038/s41598-018-32280-x http://hdl.handle.net/11536/148149 |
ISSN: | 2045-2322 |
DOI: | 10.1038/s41598-018-32280-x |
期刊: | SCIENTIFIC REPORTS |
Volume: | 8 |
顯示於類別: | 期刊論文 |