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dc.contributor.authorChiou, Hong-Wenen_US
dc.contributor.authorLee, Yu-Minen_US
dc.contributor.authorShiau, Shin-Yuen_US
dc.contributor.authorPan, Chi-Wenen_US
dc.contributor.authorChen, Tai-Yuen_US
dc.date.accessioned2020-02-02T23:55:34Z-
dc.date.available2020-02-02T23:55:34Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-1-4503-6007-4en_US
dc.identifier.urihttp://dx.doi.org/10.1145/3287624.3287632en_US
dc.identifier.urihttp://hdl.handle.net/11536/153678-
dc.description.abstractThis work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3:58% maximum error and 1:72 degrees C di fference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well.en_US
dc.language.isoen_USen_US
dc.titlePhone-nomenon: A System-Level Thermal Simulator for Handheld Devicesen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1145/3287624.3287632en_US
dc.identifier.journal24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019)en_US
dc.citation.spage538en_US
dc.citation.epage543en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000507459700095en_US
dc.citation.woscount0en_US
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