完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chiou, Hong-Wen | en_US |
dc.contributor.author | Lee, Yu-Min | en_US |
dc.contributor.author | Shiau, Shin-Yu | en_US |
dc.contributor.author | Pan, Chi-Wen | en_US |
dc.contributor.author | Chen, Tai-Yu | en_US |
dc.date.accessioned | 2020-02-02T23:55:34Z | - |
dc.date.available | 2020-02-02T23:55:34Z | - |
dc.date.issued | 2019-01-01 | en_US |
dc.identifier.isbn | 978-1-4503-6007-4 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1145/3287624.3287632 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/153678 | - |
dc.description.abstract | This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3:58% maximum error and 1:72 degrees C di fference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Phone-nomenon: A System-Level Thermal Simulator for Handheld Devices | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.doi | 10.1145/3287624.3287632 | en_US |
dc.identifier.journal | 24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019) | en_US |
dc.citation.spage | 538 | en_US |
dc.citation.epage | 543 | en_US |
dc.contributor.department | 交大名義發表 | zh_TW |
dc.contributor.department | 電信工程研究所 | zh_TW |
dc.contributor.department | National Chiao Tung University | en_US |
dc.contributor.department | Institute of Communications Engineering | en_US |
dc.identifier.wosnumber | WOS:000507459700095 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 會議論文 |