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dc.contributor.authorChu, Wen-Xiaoen_US
dc.contributor.authorWu, Jui-Linen_US
dc.contributor.authorTsui, Yeng-Yungen_US
dc.contributor.authorWang, Chi-Chuanen_US
dc.date.accessioned2020-05-05T00:01:28Z-
dc.date.available2020-05-05T00:01:28Z-
dc.date.issued2020-03-01en_US
dc.identifier.issn1043-7398en_US
dc.identifier.urihttp://dx.doi.org/10.1115/1.4044775en_US
dc.identifier.urihttp://hdl.handle.net/11536/153911-
dc.description.abstractThis study focused on the improved designs of airflow management in container data centers having overhead air supply. The computational fluid dynamics (CFD) model is first validated with experimental results. Then, the impact of grille diameter, deflector angle, and air supply layout on the data center thermal performance is investigated. The results show that the larger grille diameter may reduce the volumetric flowrate through the upstream grille, causing insufficient air supply and strong hot-air recirculation at the first rack A1. By decreasing the grille diameter from 335 mm to 235 mm, the average rack cooling index (RCI) and supply heat index (SHI) can be improved from 25.4% and 0.292 to 65% and 0.258, respectively. However, implementing small diameter grilles is not an economic way for data center performance improvement as far as the energy consumption is concerned due to the high pumping power. Meanwhile, raising the deflector angle below 30 deg in grille S1 can provide moderate improvement on temperature of the A1 rack. A further rise in the deflector to 40 deg may impose severe deterioration with a pronounced hot-spot area. The data center performance can be improved by changing from center-cold-aisle arrangement to center-hot-aisle layout. The layout provides much higher return air temperature and the RCI and SHI can be improved by 32.7% and 34.5%, respectively.en_US
dc.language.isoen_USen_US
dc.subjectsimulated container data centeren_US
dc.subjectCFDen_US
dc.subjectair supply layouten_US
dc.subjectRCI and SHIen_US
dc.subjectpumping poweren_US
dc.titleImpact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Centeren_US
dc.typeArticleen_US
dc.identifier.doi10.1115/1.4044775en_US
dc.identifier.journalJOURNAL OF ELECTRONIC PACKAGINGen_US
dc.citation.volume142en_US
dc.citation.issue1en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000514640900012en_US
dc.citation.woscount0en_US
Appears in Collections:Articles