完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Li, Yu-Jin | en_US |
dc.contributor.author | Tu, King-Ning | en_US |
dc.contributor.author | Chen, Chih | en_US |
dc.date.accessioned | 2020-05-05T00:02:17Z | - |
dc.date.available | 2020-05-05T00:02:17Z | - |
dc.date.issued | 2020-03-01 | en_US |
dc.identifier.uri | http://dx.doi.org/10.3390/ma13051211 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/154085 | - |
dc.description.abstract | Tensile tests on two kinds of electroplated copper foils with twins before and after annealing were performed. One electroplating parameter results in a microstructure of <110>-oriented microtwinned Cu (mt-Cu), and the other is <111>-oriented nanotwinned Cu (nt-Cu). The latter shows higher thermal stability than the former after annealing. Though the toughness for the two as-plated foils are quite close, the toughness for the <111> oriented nt-Cu increased from 34 to 74 MJ/m(3) after annealing at 250 degrees C for 3 h. In comparison, the toughness of the <110>-oriented mt-Cu remained almost the same after annealing. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | nano-twinned Cu | en_US |
dc.subject | toughness | en_US |
dc.subject | thermal stability | en_US |
dc.subject | electroplated Cu | en_US |
dc.title | Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.3390/ma13051211 | en_US |
dc.identifier.journal | MATERIALS | en_US |
dc.citation.volume | 13 | en_US |
dc.citation.issue | 5 | en_US |
dc.citation.spage | 0 | en_US |
dc.citation.epage | 0 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | 國際半導體學院 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.contributor.department | International College of Semiconductor Technology | en_US |
dc.identifier.wosnumber | WOS:000524060200189 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 期刊論文 |