標題: Novel Siloxane-Modified Epoxy Resins as Promising Encapsulant for LEDs
作者: Lin, Chih-Hao
Whang, Wha-Tzong
Chen, Chun-Hua
Huang, Shu-Chen
Chen, Kai-Chi
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: siloxane-modified epoxy;crosslinking density;sulfurization resistance;surface mounted device LEDs;encapsulant
公開日期: 1-Jan-2020
摘要: This study investigated a new category of transparent encapsulant materials for light-emitting diodes (LEDs). It comprised a phenyl group that contained siloxane-modified epoxy (SEP-Ph) hybridized with a cyclic tetrafunctional siloxane-modified epoxy (SEP-D4) with methylhexahydrophthalic anhydride (MHHPA) as a curing agent. The SEP-Ph/SEP-D4 = 0.5/0.5 (sample 3) and SEP-D4 (sample 4) could provide notably high optical transmittance (over 90% in the visible region), high-temperature discoloration resistance, low stress, and more crucially, noteworthy sulfurization resistance. The lumen flux retention of the SEP encapsulated surface mounted device LEDs remained between approximately 97% and 99% after a sulfurization test for 240 h. The obtained comprehensive optical, mechanical, and sulfurization resistance proved the validity and uniqueness of the present design concept with complementary physical and chemical characteristics.
URI: http://dx.doi.org/10.3390/polym12010021
http://hdl.handle.net/11536/154188
DOI: 10.3390/polym12010021
期刊: POLYMERS
Volume: 12
Issue: 1
起始頁: 0
結束頁: 0
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