Full metadata record
DC FieldValueLanguage
dc.contributor.authorWu, Chia Huangen_US
dc.contributor.authorHsu, Ya Chenen_US
dc.contributor.authorPearn, Wen Leaen_US
dc.date.accessioned2020-10-05T02:01:08Z-
dc.date.available2020-10-05T02:01:08Z-
dc.date.issued1970-01-01en_US
dc.identifier.issn0748-8017en_US
dc.identifier.urihttp://dx.doi.org/10.1002/qre.2724en_US
dc.identifier.urihttp://hdl.handle.net/11536/155182-
dc.description.abstractNowadays, electronic products are progressively becoming thinner, lighter, and more convenient for people to use. Printed circuit boards, and especially integrated circuit (IC) substrates, are among the essential component of these products. The IC substrate not only protects circuits, fixes lines, and conducts heat, but is also the critical component that provides signal connectivity between the chip, the printed circuit boards, and other crucial parts during the packaging process. The process capability indexC(pm)is commonly used to assess the product quality loss for decision making in modern semiconductor packaging manufacturing. For high-definition products, packaging processes often have very strict quality requirements and thus the quality inspection procedure is time-consuming and complicated. Therefore, because of the limitation of manpower and capacity of the inspection instruments, the collected sample for quality assessment may be with small to moderate sample sizes. In this paper, we introduce an unbiased estimator forC(pm)and provide a step-by-step parametric bootstrap procedure for obtaining a composite lower confidence bound onC(pm). To compare with the approaches discussed in the literature, numerical simulations are conducted under various process parameter settings. The results show that for small to moderate sample sizes, the proposed method applying the unbiased estimator has more accurate coverage rates than the existing methods. At the end of this paper, an application of quality loss assessment in notching processes is demonstrated.en_US
dc.language.isoen_USen_US
dc.subjectlower confidence bounden_US
dc.subjectnotching processesen_US
dc.subjectparametric bootstrap methoden_US
dc.subjectquality lossen_US
dc.subjectunbiased estimatoren_US
dc.titleAn improved measure of quality loss for notching processesen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/qre.2724en_US
dc.identifier.journalQUALITY AND RELIABILITY ENGINEERING INTERNATIONALen_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000552730700001en_US
dc.citation.woscount0en_US
Appears in Collections:Articles