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dc.contributor.authorYeh, Chih-Tingen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2014-12-08T15:22:20Z-
dc.date.available2014-12-08T15:22:20Z-
dc.date.issued2012-03-01en_US
dc.identifier.issn1549-7747en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCSII.2012.2184372en_US
dc.identifier.urihttp://hdl.handle.net/11536/15809-
dc.description.abstractA new 2 x VDD-tolerant power-rail electrostatic discharge (ESD) clamp circuit realized with only thin gate oxide 1-V (1 x VDD) devices and a silicon-controlled rectifier (SCR) as the main ESD clamp device has been proposed and verified in a 65-nm CMOS process. This new design has a low standby leakage current by reducing the voltage difference across the gate oxide of the devices in the ESD detection circuit. The proposed design with an SCR width of 50 mu m can achieve a 6.5-kV human-body-model ESD level, a 300-V machine-model ESD level, and a low standby leakage current of only 103.7 nA at room temperature under the normal circuit operating condition with 1.8 V bias.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectholding voltageen_US
dc.subjectmixed-voltage I/O buffersen_US
dc.subjectpower-rail ESD clamp circuiten_US
dc.titleNew Design of 2 x VDD-Tolerant Power-Rail ESD Clamp Circuit for Mixed-Voltage I/O Buffers in 65-nm CMOS Technologyen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCSII.2012.2184372en_US
dc.identifier.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFSen_US
dc.citation.volume59en_US
dc.citation.issue3en_US
dc.citation.spage178en_US
dc.citation.epage182en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000302102400010-
dc.citation.woscount3-
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