Thermomigration of Ti in flip-chip solder joints

Title:	Thermomigration of Ti in flip-chip solder joints
Authors:	Chen, Hsiao-Yun Lin, Han-Wen Liu, Chien-Min Chang, Yuan-Wei Huang, Annie T. Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering
Keywords:	Diffusion;Intermetallic compounds;Soldering;Titanium
Issue Date:	1-May-2012
Abstract:	Titanium has a very large heat of transport value of -768 kJ mol(-1). However, thermomigration of Ti in solder joints has not been examined. In this study, void formation was observed in non-current-stressed Al traces during electromigration and thermomigration tests of SnAg solder joints. Voids formed inside the traces located above the solder bumps with no current flow. We found that Ti thermomigration occurred in the joint, resulting in the reaction of Al and Cu, leaving voids behind in the Al trace. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI:	http://hdl.handle.net/11536/16015
ISSN:	1359-6462
Journal:	SCRIPTA MATERIALIA
Volume:	66
Issue:	9
End Page:	694
Appears in Collections:	Articles

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