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dc.contributor.authorLo, Wen-Hungen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTsai, Jyun-Yuen_US
dc.contributor.authorDai, Chih-Haoen_US
dc.contributor.authorChen, Ching-Enen_US
dc.contributor.authorHo, Szu-Hanen_US
dc.contributor.authorChen, Hua-Maoen_US
dc.contributor.authorCheng, Osberten_US
dc.contributor.authorHuang, Cheng-Tungen_US
dc.date.accessioned2014-12-08T15:22:43Z-
dc.date.available2014-12-08T15:22:43Z-
dc.date.issued2012-04-09en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/152102en_US
dc.identifier.urihttp://hdl.handle.net/11536/16044-
dc.description.abstractThis letter studies the channel hot carrier stress (CHCS) behaviors on high dielectric constant insulator and metal gate HfO2/TiN p-channel metal-oxide-semiconductor field effect transistors. It can be found that the degradation is associated with electron trapping, resulting in G(m) decrease and positive Vth shift. However, Vth under saturation region shows an insignificant degradation during stress. To compare that, the CHC-induced electron trapping induced DIBL is proposed to demonstrate the different behavior of Vth between linear and saturation region. The devices with different channel length are used to evidence the trapping-induced DIBL behavior. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.3697644]en_US
dc.language.isoen_USen_US
dc.titleCharge trapping induced drain-induced-barrier-lowering in HfO2/TiN p-channel metal-oxide-semiconductor-field-effect-transistors under hot carrier stressen_US
dc.typeArticleen_US
dc.identifier.doi152102en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume100en_US
dc.citation.issue15en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000303128000027-
dc.citation.woscount9-
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