Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Leu, Jihperng | en_US |
dc.contributor.author | Chang, Chin-Cheng | en_US |
dc.contributor.author | Chen, Alexander | en_US |
dc.contributor.author | Lin, Mao-Hsing | en_US |
dc.contributor.author | Huang, Kun-Feng | en_US |
dc.date.accessioned | 2014-12-08T15:22:57Z | - |
dc.date.available | 2014-12-08T15:22:57Z | - |
dc.date.issued | 2012-01-01 | en_US |
dc.identifier.issn | 1071-0922 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/16181 | - |
dc.description.abstract | Mura defects become visible in a 13.3-in. TFT-LCD using chip-on-glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non-uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC-driver Si chips. In this paper, a 3-D finite-element-analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper-glass-plate post-COG-package processing for identifying the root causes of the light-leakage phenomenon. Prior to that, the simulated warpage results are validated by surface-contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low-cost solution for eliminating mura defects. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Mura | en_US |
dc.subject | chip-on-glass | en_US |
dc.subject | warpage | en_US |
dc.subject | stress | en_US |
dc.subject | finite-element method | en_US |
dc.title | Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD | en_US |
dc.type | Article | en_US |
dc.identifier.journal | JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY | en_US |
dc.citation.volume | 20 | en_US |
dc.citation.issue | 1 | en_US |
dc.citation.epage | 28 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000301925300004 | - |
dc.citation.woscount | 0 | - |
Appears in Collections: | Articles |