Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation

標題:	Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
作者:	Huang, Juinn-Dar Huang, Ya-Shih Hsu, Mi-Yu Chang, Han-Yuan 交大名義發表 National Chiao Tung University
關鍵字:	Three-dimensional integration;3D FPGAs;thermal-aware placement;logic block placement
公開日期:	2012
URI:	http://hdl.handle.net/11536/16229
ISBN:	978-1-4503-1155-7
期刊:	FPGA 12: PROCEEDINGS OF THE 2012 ACM-SIGDA INTERNATIONAL SYMPOSIUM ON FIELD PROGRAMMABLE GATE ARRAYS
結束頁:	268
顯示於類別：	會議論文