Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Huang, Juinn-Dar	en_US
dc.contributor.author	Huang, Ya-Shih	en_US
dc.contributor.author	Hsu, Mi-Yu	en_US
dc.contributor.author	Chang, Han-Yuan	en_US
dc.date.accessioned	2014-12-08T15:23:05Z	-
dc.date.available	2014-12-08T15:23:05Z	-
dc.date.issued	2012	en_US
dc.identifier.isbn	978-1-4503-1155-7	en_US
dc.identifier.uri	http://hdl.handle.net/11536/16229	-
dc.language.iso	en_US	en_US
dc.subject	Three-dimensional integration	en_US
dc.subject	3D FPGAs	en_US
dc.subject	thermal-aware placement	en_US
dc.subject	logic block placement	en_US
dc.title	Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation	en_US
dc.type	Meeting Abstract	en_US
dc.identifier.journal	FPGA 12: PROCEEDINGS OF THE 2012 ACM-SIGDA INTERNATIONAL SYMPOSIUM ON FIELD PROGRAMMABLE GATE ARRAYS	en_US
dc.citation.epage	268	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.identifier.wosnumber	WOS:000304019700045	-
顯示於類別：	會議論文