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dc.contributor.authorChang, Kow-Mingen_US
dc.contributor.authorHuang, Sung-Hungen_US
dc.contributor.authorChi, Chia-Weien_US
dc.contributor.authorWu, Chin-Jyien_US
dc.contributor.authorLin, Je-Weien_US
dc.contributor.authorChang, Chia-Chiangen_US
dc.date.accessioned2014-12-08T15:23:24Z-
dc.date.available2014-12-08T15:23:24Z-
dc.date.issued2011en_US
dc.identifier.isbn978-1-60768-217-2en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/16396-
dc.description.abstractThin film transistors (TFTs) with a ZnO channel layer deposited by atmospheric pressure plasma jet (APPJ) were demonstrated. ZnO channel layers were fabricated with a non-vacuum and low-temperature process (100 degrees C). The effects of different carrier gases (nitrogen gas and compressed dry air) and channel thickness on the characteristics of ZnO TFTs were investigated. Reactive oxygen species can effectively repair the oxygen vacancies result in a low leakage current. By reducing the channel thickness, the undesired source to drain current flow can be eliminated. By using CDA as a carrier gas and reducing the channel thickness, a subthreshold swing of 3.75 V/decade, a field-effect mobility of 3.49 cm(2)/Vs and a Ion/Ioff current ratio of 4.08x10(7) were obtained.en_US
dc.language.isoen_USen_US
dc.titleThe Effect of Different Carrier Gases and Channel Thicknesses on the Characteristics of ZnO TFTs Prepared by Atmospheric Pressure Plasma Jeten_US
dc.typeProceedings Paperen_US
dc.identifier.journalWIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 12en_US
dc.citation.volume35en_US
dc.citation.issue6en_US
dc.citation.epage199en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000305936300023-
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