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dc.contributor.authorYang, Hao-Yuen_US
dc.contributor.authorChang, Chi-Minen_US
dc.contributor.authorChao, Mango C. -T.en_US
dc.contributor.authorHuang, Rei-Fuen_US
dc.contributor.authorLin, Shih-Chinen_US
dc.date.accessioned2014-12-08T15:23:46Z-
dc.date.available2014-12-08T15:23:46Z-
dc.date.issued2012-09-01en_US
dc.identifier.issn1063-8210en_US
dc.identifier.urihttp://hdl.handle.net/11536/16588-
dc.description.abstract"The embedded-DRAM(eDRAM) testing mixes up the techniques used for DRAM testing and SRAM testing since an eDRAM core combines DRAM cells with an SRAM interface (the so-called 1T-SRAM architecture). In this paper, we first present our test algorithm for eDRAM testing. A theoretical analysis to the leakage mechanisms of a switch transistor is also provided, based on that we can test the eDRAM at a higher temperature to reduce the total test time and maintain the same retention-fault coverage. Finally, we propose a mathematical model to estimate the defect level caused by wear-out defects under the use of error-correction-code circuitry, which is a special function used in eDRAMs compared to commodity DRAMs. The experimental results are collected based on 1-lot wafers with an 16 Mb eDRAM core."en_US
dc.language.isoen_USen_US
dc.subjectEmbedded-DRAM (eDRAM)en_US
dc.subjectfault modelen_US
dc.subjectretentionen_US
dc.subjecterror-correction-codeen_US
dc.titleTesting Methodology of Embedded DRAMsen_US
dc.typeArticleen_US
dc.identifier.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSen_US
dc.citation.volume20en_US
dc.citation.issue9en_US
dc.citation.epage1715en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000306518900015-
dc.citation.woscount3-
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