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dc.contributor.authorChen, Shih-Hungen_US
dc.contributor.authorLin, Yueh-Chinen_US
dc.contributor.authorLinten, Dimitrien_US
dc.contributor.authorScholz, Mirkoen_US
dc.contributor.authorHellings, Geerten_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorGroeseneken, Guidoen_US
dc.date.accessioned2014-12-08T15:24:17Z-
dc.date.available2014-12-08T15:24:17Z-
dc.date.issued2012-09-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2012.2204951en_US
dc.identifier.urihttp://hdl.handle.net/11536/16881-
dc.description.abstractGaAs high-electron-mobility transistors (HEMTs) have been widely used for radio-frequency (RF) applications due to the excellent material properties. One of the essential elements of the HEMTs is the gate Schottky barrier layer. InGaP has been proposed and proven as a better Schottky barrier material for the RF performance of the GaAs HEMTs. This letter investigates the influence of the GaAs HEMTs with two different Schottky layers, which are InGaP and AlGaAs on device transient characteristics under electrostatic discharge (ESD) stress. Although InGaP presents significant advantages on improving RF performance of GaAs HEMTs, it shows inferiority in ESD robustness.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectGaAs pseudomorphic high-electron-mobility transistor (pHEMT)en_US
dc.subjectInGaP Schottky layeren_US
dc.subjecttransmission-line pulsing (TLP) systemsen_US
dc.titleInfluence of InGaP and AlGaAs Schottky Layers on ESD Robustness in GaAs pHEMTsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2012.2204951en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume33en_US
dc.citation.issue9en_US
dc.citation.spage1252en_US
dc.citation.epage1254en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000308021800012-
dc.citation.woscount0-
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