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dc.contributor.authorLi, Yimingen_US
dc.contributor.authorCheng, Hui-Wenen_US
dc.contributor.authorHwang, Chi-Hongen_US
dc.date.accessioned2014-12-08T15:24:27Z-
dc.date.available2014-12-08T15:24:27Z-
dc.date.issued2012-06-01en_US
dc.identifier.issn1533-4880en_US
dc.identifier.urihttp://dx.doi.org/10.1166/jnn.2012.6195en_US
dc.identifier.urihttp://hdl.handle.net/11536/16961-
dc.description.abstractThe random work-function (WK) induced threshold voltage fluctuation (sigma V-th) in 16 nm Titanium Nitride (TiN) metal-gate fin-type field effect transistors (FinFETs) is explored and modeled by using an experimentally validated Monte Carlo simulation approach. The influences of metal-grain size and device geometry aspect ratio on the random WK-induced sigma V-th are considered in the proposed equation analytically. The formula accounts for the inside of fluctuation and could be used for the assessment of effectiveness of suppression techniques.en_US
dc.language.isoen_USen_US
dc.subjectMetal-Gateen_US
dc.subjectTiNen_US
dc.subjectRandom Work Functionen_US
dc.subjectThreshold Voltage Fluctuationen_US
dc.subjectFinFETen_US
dc.subjectAnalytical Expressionen_US
dc.subjectMonte Carlo Simulationen_US
dc.titleThreshold Voltage Fluctuation in 16-nm-Gate FinFETs Induced by Random Work Function of Nanosized Metal Grainen_US
dc.typeArticleen_US
dc.identifier.doi10.1166/jnn.2012.6195en_US
dc.identifier.journalJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGYen_US
dc.citation.volume12en_US
dc.citation.issue6en_US
dc.citation.spage4485en_US
dc.citation.epage4488en_US
dc.contributor.department電機資訊學士班zh_TW
dc.contributor.departmentUndergraduate Honors Program of Electrical Engineering and Computer Scienceen_US
dc.identifier.wosnumberWOS:000306861000006-
dc.citation.woscount0-
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