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dc.contributor.authorHuang, Pei-Yuen_US
dc.contributor.authorLee, Yu-Minen_US
dc.contributor.authorPan, Chi-Wenen_US
dc.date.accessioned2014-12-08T15:24:33Z-
dc.date.available2014-12-08T15:24:33Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-4673-0772-7en_US
dc.identifier.issn2153-6961en_US
dc.identifier.urihttp://hdl.handle.net/11536/17017-
dc.description.abstractThis work introduces the concept of thermal yield profile for the hot-spot identification with considering process variations and provides an efficient estimating technique for the thermal yield profile. After executing a mixed-mesh strategy for generating statistical polynomial expression of the on-chip temperature distribution, the thermal yield profile is obtained by a skew-normal based moment matching technique. Comparing with the Monte Carlo method, experimental results demonstrate that our method can efficiently and accurately estimate the thermal yield profile. With the same level of accuracy, our skew-normal based method achieves 215x speedup over the state of the art, APEX [1], for estimating the thermal yield profile. Moreover, results show that our mixed-mesh statistical polynomial expression generator achieves 130x speedup over the statistical collocation based method [2] and still accurately estimates the thermal yield profile.en_US
dc.language.isoen_USen_US
dc.titleOn-Chip Statistical Hot-Spot Estimation Using Mixed-Mesh Statistical Polynomial Expression Generating and Skew-Normal Based Moment Matching Techniquesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2012 17TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC)en_US
dc.citation.spage603en_US
dc.citation.epage608en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000309240000109-
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