An on-package planar inverted-F antenna for WLAN application

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Ling, Ching-Wei	en_US
dc.contributor.author	Chung, Shyh-Jong	en_US
dc.date.accessioned	2014-12-08T15:25:01Z	-
dc.date.available	2014-12-08T15:25:01Z	-
dc.date.issued	2006	en_US
dc.identifier.isbn	0-88986-563-9	en_US
dc.identifier.uri	http://hdl.handle.net/11536/17393	-
dc.description.abstract	A novel on-package planar inverted-F antenna (PIFA) is proposed in this paper. The on-package PIFA consists of a single folded copper plate and has several advantages including compact size, light weight, low cost and easy fabrication. Besides, the antenna radiation pattern is omnidirectional in H-plane. The coupling effect between the on-package PIFA and the RF components in the shielding package is investigated. It is observed that the antenna performance is rarely changed even though the RF component is embedded in the package. In addition, the best isolation between the antenna and RF components can be achieved when the components are appropriately arranged in the package.	en_US
dc.language.iso	en_US	en_US
dc.subject	antennas	en_US
dc.subject	planar inverted-F antenna inverted-F antenna (PIFA)	en_US
dc.subject	system-on-package (SOP)	en_US
dc.subject	wireless local area networks (WLAN)	en_US
dc.title	An on-package planar inverted-F antenna for WLAN application	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	Proceedings of the Sixth IASTED International Multi-Conference on Wireless and Optical Communications	en_US
dc.citation.spage	90	en_US
dc.citation.epage	95	en_US
dc.contributor.department	電信工程研究所	zh_TW
dc.contributor.department	Institute of Communications Engineering	en_US
dc.identifier.wosnumber	WOS:000239883800015	-
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