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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorLai, Tai-Xiangen_US
dc.date.accessioned2014-12-08T15:25:06Z-
dc.date.available2014-12-08T15:25:06Z-
dc.date.issued2006en_US
dc.identifier.isbn0-7803-9498-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/17478-
dc.description.abstractIn this paper, the long-pulse transmission line pulsing (LP-TLP) system is proposed to simulate the influence of Cable Discharge Event (CDE) on integrated circuits. The layout dependence on CDE robustness of gate-grounded NMOS (GGNMOS) and gate-VDD PMOS (GDPMOS) devices has been experimentally investigated in detail. All CMOS devices with different device dimensions, layout spacings, and clearances have been drawn and fabricated in a 0.25-mu m salicided CMOS process to find optimum layout rules for CDE protection. From the measured results, the CDE robustness of CMOS devices is much worse than their HBM ESD robustness.en_US
dc.language.isoen_USen_US
dc.titleDependence of layout parameters on CDE (Cable Discharge Event) robustness of CMOS devices in a 0.25-mu m salicided CMOS processen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUALen_US
dc.citation.spage633en_US
dc.citation.epage634en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000240855800113-
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