Full metadata record
DC FieldValueLanguage
dc.contributor.authorLin, CCen_US
dc.contributor.authorLin, KLen_US
dc.contributor.authorChang, HCen_US
dc.contributor.authorLee, CYen_US
dc.date.accessioned2014-12-08T15:25:09Z-
dc.date.available2014-12-08T15:25:09Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9205-1en_US
dc.identifier.issn1930-8833en_US
dc.identifier.urihttp://hdl.handle.net/11536/17541-
dc.description.abstractIn this paper, a (1200,720) LDPC decoder based on an irregular parity check matrix is presented. For achieving higher chip density and less critical path delay, the proposed architecture features a new data reordering such that only one specific data bus exists between message memories and computational units. Moreover, the LDPC decoder can also process two different codewords concurrently to increase throughput and datapath efficiency. After chip implementation, a 3.33Gb/s data rate is achieved with 8 decoding iterations in the 21.23mm(2) 0.18 mu m silicon area. The other 0.13 mu m chip with the 10.24mm(2) core can further reach a 5.92Gb/s data rate under 1.02V supply.en_US
dc.language.isoen_USen_US
dc.titleA 3.33Gb/s (1200,720) low-density parity check code decoderen_US
dc.typeProceedings Paperen_US
dc.identifier.journalESSCIRC 2005: PROCEEDINGS OF THE 31ST EUROPEAN SOLID-STATE CIRCUITS CONFERENCEen_US
dc.citation.spage211en_US
dc.citation.epage214en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000235469600046-
Appears in Collections:Conferences Paper