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dc.contributor.authorYu, DSen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorWu, CHen_US
dc.contributor.authorLi, MFen_US
dc.contributor.authorZhu, Cen_US
dc.contributor.authorWang, SJen_US
dc.contributor.authorYoo, WJen_US
dc.contributor.authorHung, BFen_US
dc.contributor.authorMcAlister, SPen_US
dc.date.accessioned2014-12-08T15:25:11Z-
dc.date.available2014-12-08T15:25:11Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9268-Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/17581-
dc.description.abstractMetallic diffusion through high-K HfO(2), caused by high temperature metal-nitride decomposition, was reduced by using robust HfAlON. Useful dual effective work-function (phi(m,eff)) of 4.25 and 5.15 eV are obtained in TaTb(0.2)N/HfAlON and Ir/HfAlON at 1.7nm EOT. Good dual phi(m,eff) of 4.15 and 4.9 eV are also obtained in Yb(x)Si/HfAlON and Ir(x)Si/HfAlON FUSI-gates by reduced metal diffusion at lower temperature.en_US
dc.language.isoen_USen_US
dc.titleLanthanide and Ir-based dual metal-gate/HfAlON CMOS with large work-function differenceen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGESTen_US
dc.citation.spage649en_US
dc.citation.epage652en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000236225100147-
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