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dc.contributor.authorChin, Aen_US
dc.contributor.authorKao, HLen_US
dc.contributor.authorTseng, YYen_US
dc.contributor.authorYu, DSen_US
dc.contributor.authorChen, CCen_US
dc.contributor.authorMcAlister, SPen_US
dc.contributor.authorChi, CCen_US
dc.date.accessioned2014-12-08T15:25:15Z-
dc.date.available2014-12-08T15:25:15Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9203-5en_US
dc.identifier.issn1930-8876en_US
dc.identifier.urihttp://hdl.handle.net/11536/17622-
dc.identifier.urihttp://dx.doi.org/10.1109/ESSDER.2005.1546641en_US
dc.description.abstractWe have used process and device simulation tools (T-Supreme and Medici) to analyze the measured DC characteristics of Ge-on-Insulator (GOI) MOSFETs. The GOI devices have higher drive current than do their Si counterparts, due to the smaller effective mass (m) and smaller Ge energy bandgap - however this also causes a larger off-state I(ds) leakage current. The simulations predict that the GOI MOSFETs have better RF gain and noise performance compared with Si devices. This is important for high speed operation as down-scaling continues.en_US
dc.language.isoen_USen_US
dc.titlePhysics and modeling of Ge-on-Insulator MOSFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ESSDER.2005.1546641en_US
dc.identifier.journalPROCEEDINGS OF ESSDERC 2005: 35TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCEen_US
dc.citation.spage285en_US
dc.citation.epage288en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000236176200064-
Appears in Collections:Conferences Paper


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