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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChen, Shih-Lunen_US
dc.date.accessioned2014-12-08T15:25:20Z-
dc.date.available2014-12-08T15:25:20Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9162-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/17720-
dc.identifier.urihttp://dx.doi.org/10.1109/ASSCC.2005.251689en_US
dc.description.abstractAn on-chip high-voltage charge pump circuit realized with the polysilicon diodes in standard (bulk) CMOS process is presented in this paper. Because the polysilicon diodes are fully isolated from the substrate, the output voltage of the charge pump circuit is not limited by the junction breakdown voltage of MOSFETs. The polysilicon diodes can be implemented in the standard CMOS processes without extra process steps. The proposed charge pump circuit has been fabricated in a 0.25-mu m 2.5-V standard CMOS process. The output voltage of the 12-stage charge pump circuit can be pumped up to 28.08 V, which is much higher than the n-well/p-substrate breakdown voltage (18.9 V) in a 0.25-mu m 2.5-V standard CMOS process.en_US
dc.language.isoen_USen_US
dc.titleOn-chip high-voltage charge pump circuit in standard CMOS processes with polysilicon diodesen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ASSCC.2005.251689en_US
dc.identifier.journal2005 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERSen_US
dc.citation.spage157en_US
dc.citation.epage160en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000240872200040-
Appears in Collections:Conferences Paper


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