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dc.contributor.authorKer, MDen_US
dc.contributor.authorChang, WJen_US
dc.contributor.authorYang, Men_US
dc.contributor.authorChen, CCen_US
dc.contributor.authorChan, MCen_US
dc.contributor.authorShieh, WTen_US
dc.contributor.authorYen, KLen_US
dc.date.accessioned2014-12-08T15:25:32Z-
dc.date.available2014-12-08T15:25:32Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9301-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/17937-
dc.description.abstractA new ESD protection structure of HVPSCR embedded into the high-voltage PMOS device is proposed to greatly improve ESD robustness of the vacuum-fluorescent-display (VFD) driver IC for automotive electronics applications. By only adding the additional N+ diffusion into the drain region of HVPMOS, the 112 of output cell has been greatly improved form 0.07A to be greater than 6A within the almost same layout area. Such an ESD-enhanced VFD driver IC has been in mass production for automotive applications in car to sustain HBM ESD stress of up to 8kV.en_US
dc.language.isoen_USen_US
dc.titleESD protection structure with embedded high-voltage p-type SCR for automotive vacuum-fluorescent-display (VFD) applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIPFA 2005: Proceedings of the 12th International Symposium on the Physical & Failure Analysis of Integrated Circuitsen_US
dc.citation.spage67en_US
dc.citation.epage70en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000232593400015-
Appears in Collections:Conferences Paper