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dc.contributor.authorTsai, LNen_US
dc.contributor.authorCheng, YTen_US
dc.contributor.authorHsu, WSen_US
dc.date.accessioned2014-12-08T15:25:33Z-
dc.date.available2014-12-08T15:25:33Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-8732-5en_US
dc.identifier.issn1084-6999en_US
dc.identifier.urihttp://hdl.handle.net/11536/17947-
dc.description.abstractWe employ a low-temperature stress-free electroplated nickel (EL) process with the addition of uniformly dispersed nanoparticles of diamond (< 500 nm) or SiO2 (< 80 nm) to investigate "nanocomposite effects" for the first time on the modification of the thermal expansion coefficient (CTE) and other mechanical properties of nickel and its correlation to power and reliability improvement of electro-thermal microactuators. Experimental results show that these material parameters can be either enhanced or deteriorated via the incorporation of different kind of nanopowders. Although the mechanical strength enhancement can be attributed to the intrinsic characteristics of the nanoparticle based on the rule of mixture, the discrepancy of CTE modification can only be explained with distinct composite microstructures which result in the performance improvement of the electro-thermal microactuator. This work has led to a possible research direction in the development of MEMS using the nanocomposites.en_US
dc.language.isoen_USen_US
dc.titleNanocomposite effects on the coefficient of thermal expansion modification for high performance electro-thermal microactuatoren_US
dc.typeProceedings Paperen_US
dc.identifier.journalMEMS 2005 Miami: Technical Digesten_US
dc.citation.spage467en_US
dc.citation.epage470en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000228430000116-
Appears in Collections:Conferences Paper