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dc.contributor.authorWang, TYen_US
dc.contributor.authorChen, WZen_US
dc.contributor.authorTsai, CMen_US
dc.contributor.authorHuang, LRen_US
dc.contributor.authorLi, DUen_US
dc.date.accessioned2014-12-08T15:25:38Z-
dc.date.available2014-12-08T15:25:38Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9060-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/18043-
dc.description.abstractThis paper describes the design of a 10Gb/s laser diode (LD) driver in a 0.35 mu m SiGe BiCMOS technology. The LD driver delivers a biased current up to 60 mA, and a modulation current ranges from 40 mA to 100 mA. High speed operation as well as high current driving capability are achieved by means of push-pull current switching scheme. In addition, negative Miller capacitor compensation technique is adopted to enhance the signal bandwidth. The output swing of the predriver is dynamically adjustable to compromise between operating speed and overshoot. Both the modulation and biased currents are derived from a bandgap reference source. The measured rise/fall time is 47ps, and timing jitter is 22.2ps(p-p). The eye diagrams meet the specifications defined by SONET OC-192 and 10G Ethernet eye mask. Operating under 3.3V/7V supply, the total power consumption is 1.38W. Chip size is 1430 x 940 mu m(2).en_US
dc.language.isoen_USen_US
dc.titleA 10-Gb/s laser diode driver in 0.35 mu m BiCMOS technologyen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2005 IEEE VLSI-TSA International Symposium on VLSI Design, Automation & Test (VLSI-TSA-DAT), Proceedings of Technical Papersen_US
dc.citation.spage253en_US
dc.citation.epage256en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000233985300065-
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