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dc.contributor.authorLin, YHen_US
dc.contributor.authorChien, CHen_US
dc.contributor.authorLin, CTen_US
dc.contributor.authorChen, CWen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:25:43Z-
dc.date.available2014-12-08T15:25:43Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7803-8684-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/18128-
dc.description.abstractIn this paper, we exploit a novel technique for preparing high density HfO2 nanocrystals with an average size < 10nm using spinodal phase separation of Hf-silicate thin film by 900degreesC rapid thermal annealing for nonvolatile memories. The density can be as high as 0.9similar to1.9x10(12)cm(-2). Owing to the fact that HfO2 nanocrystals are well embedded inside SiO2 matrix and their sufficiently deep energy level, we, for the first time, have demonstrated superior characteristics of the nanocrystal memory in terms of considerably large memory window, high speed program/erase (1mus/0.1ms), long retention time greater than 10(8)s for 10% charge loss, excellent endurance after 10(6) P/E cycles, negligible read/write disturbances and multi-bit operation.en_US
dc.language.isoen_USen_US
dc.titleHigh performance multi-bit nonvolatile HfO2 nanocrystal memory using spinodal phase separation of hafnium silicateen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGESTen_US
dc.citation.spage1080en_US
dc.citation.epage1082en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000227158500250-
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