A tool portfolio elimination mechanism (TPEM) for a wafer fab

doi:10.1109/ISAPM.2004.1287988

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DC 欄位	值	語言
dc.contributor.author	Chung, SH	en_US
dc.contributor.author	Hsieh, MH	en_US
dc.contributor.author	Liu, JC	en_US
dc.date.accessioned	2014-12-08T15:25:48Z	-
dc.date.available	2014-12-08T15:25:48Z	-
dc.date.issued	2004	en_US
dc.identifier.isbn	0-7803-8469-5	en_US
dc.identifier.uri	http://hdl.handle.net/11536/18230	-
dc.identifier.uri	http://dx.doi.org/10.1109/ISAPM.2004.1287988	en_US
dc.description.abstract	Wafer manufacturers usually face critical problems when making decisions regarding to the tool portfolio elimination, mainly due to the dramatic and frequent influences from their internal and external environments. This paper is aimed to develop a mechanism, named Tool Portfolio Elimination Mechanism (TPEM), to evaluate the impacts on production performance and capital expenditure, and to determine which equipment is suitable for pruning. In TPEM, there are four stages to decide tool portfolio elimination according to the PDCA cycle. Meanwhile, the simulation results show; that the fab production performance and cost are much improved by the TPEM algorithm. Especially, it can be applied and implemented to industry very quickly and easily.	en_US
dc.language.iso	en_US	en_US
dc.title	A tool portfolio elimination mechanism (TPEM) for a wafer fab	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.doi	10.1109/ISAPM.2004.1287988	en_US
dc.identifier.journal	2004 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP PROCEEDINGS	en_US
dc.citation.spage	51	en_US
dc.citation.epage	53	en_US
dc.contributor.department	工業工程與管理學系	zh_TW
dc.contributor.department	Department of Industrial Engineering and Management	en_US
dc.identifier.wosnumber	WOS:000225401500012	-
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