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dc.contributor.authorKer, MDen_US
dc.contributor.authorChen, WYen_US
dc.date.accessioned2014-12-08T15:25:51Z-
dc.date.available2014-12-08T15:25:51Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7695-2093-6en_US
dc.identifier.urihttp://hdl.handle.net/11536/18285-
dc.description.abstractAlthough the gate-driven (or gate-coupled) technique was reported to improve ESD robustness of NMOS devices, the over-gate-driven effect has been found to degrade ESD level. This effect makes the gate-driven technique hard to be well optimized in deep-submicron CMOS ICs. In this work, a new design is proposed to overcome such over-gate-driven effect by circuit design and to achieve the maximum ESD capability of devices. The experimental results have shown significant improvement on the machine-model (MM) ESD robustness of ESD protection circuit by this new proposed design. This new design is portable (process-migration) for applications in different CMOS processes without modifying the process step or mask layer.en_US
dc.language.isoen_USen_US
dc.titleDesign to avoid the over-gate-driven effect on ESD protection circuits in deep-submicron CMOS processesen_US
dc.typeProceedings Paperen_US
dc.identifier.journalISQED 2004: 5TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, PROCEEDINGSen_US
dc.citation.spage445en_US
dc.citation.epage450en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000221356900073-
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