完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chin, A | en_US |
dc.contributor.author | Kao, HL | en_US |
dc.contributor.author | Yu, DS | en_US |
dc.contributor.author | Liao, CC | en_US |
dc.contributor.author | Zhu, C | en_US |
dc.contributor.author | Li, MF | en_US |
dc.contributor.author | Zhu, SY | en_US |
dc.contributor.author | Kwong, DL | en_US |
dc.date.accessioned | 2014-12-08T15:25:55Z | - |
dc.date.available | 2014-12-08T15:25:55Z | - |
dc.date.issued | 2004 | en_US |
dc.identifier.isbn | 0-7803-8511-X | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/18361 | - |
dc.description.abstract | We propose and demonstrate a new VLSI structure using high performance metal-gate/high-kappa MOSFETs and high-Q RF passive devices on Ge-on- Insulator (GOI) platform. In additional to high RF performance passive devices on insulating Si formed by ion implantation. the metal-gate/(La)AiO(3)/GOI MOSFETs have 1.7-2.0X improved electron and hole mobility with the merits of minimizing interfacial reaction., high-kappa crystallization, Fermi-level pinning, and impurity diffusion due to low thermal budget of 500 degrees C RTA. | en_US |
dc.language.iso | en_US | en_US |
dc.title | High performance metal-gate/high-kappa, MOSFETs and GaAs compatible RF passive devices on Ge-on-Insulator tlechnology | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS | en_US |
dc.citation.spage | 302 | en_US |
dc.citation.epage | 305 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000227342200070 | - |
顯示於類別: | 會議論文 |