標題: Noise-aware buffer planning for interconnect-driven floorplanning
作者: Li, SM
Cherng, YH
Chang, YW
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2003
摘要: Crosstalk-induced noise has become a key problem in interconnect optimization when technology improves, spacing diminishes, and coupling capacitance/inductance increases. Buffer insertion/sizing is one of the most effective and popular techniques to reduce interconnect delay and decouple coupling effects. It is traditionally applied to post-layout optimization. However it is obviously infeasible to insert/size hundreds of thousands buffers during the post-layout stage when most routing regions are occupied. Therefore, it is desirable to incorporate buffer planning into floorplanning to ensure timing closure and design convergence. In this paper, we first derive formulae of buffer insertion for timing and noise optimization, and then apply the formulae to compute the feasible regions for inserting buffers to meet both timing and noise constraints. Experimental results show that our approach achieves an average success rate of 80.9% (78.2%) of nets meeting timing constraints alone (both timing and noise constraints) and consumes an average extra area of only 0.49% (0.66%) over the given floorplan, compared with the average success rate of 75.6% of nets meeting timing constraints alone and an extra area of 1.33% by the BBP method [3].
URI: http://hdl.handle.net/11536/18575
ISBN: 0-7803-7659-5
期刊: ASP-DAC 2003: PROCEEDINGS OF THE ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE
起始頁: 423
結束頁: 426
顯示於類別:會議論文