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dc.contributor.authorLi, SMen_US
dc.contributor.authorCherng, YHen_US
dc.contributor.authorChang, YWen_US
dc.date.accessioned2014-12-08T15:26:11Z-
dc.date.available2014-12-08T15:26:11Z-
dc.date.issued2003en_US
dc.identifier.isbn0-7803-7659-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/18575-
dc.description.abstractCrosstalk-induced noise has become a key problem in interconnect optimization when technology improves, spacing diminishes, and coupling capacitance/inductance increases. Buffer insertion/sizing is one of the most effective and popular techniques to reduce interconnect delay and decouple coupling effects. It is traditionally applied to post-layout optimization. However it is obviously infeasible to insert/size hundreds of thousands buffers during the post-layout stage when most routing regions are occupied. Therefore, it is desirable to incorporate buffer planning into floorplanning to ensure timing closure and design convergence. In this paper, we first derive formulae of buffer insertion for timing and noise optimization, and then apply the formulae to compute the feasible regions for inserting buffers to meet both timing and noise constraints. Experimental results show that our approach achieves an average success rate of 80.9% (78.2%) of nets meeting timing constraints alone (both timing and noise constraints) and consumes an average extra area of only 0.49% (0.66%) over the given floorplan, compared with the average success rate of 75.6% of nets meeting timing constraints alone and an extra area of 1.33% by the BBP method [3].en_US
dc.language.isoen_USen_US
dc.titleNoise-aware buffer planning for interconnect-driven floorplanningen_US
dc.typeProceedings Paperen_US
dc.identifier.journalASP-DAC 2003: PROCEEDINGS OF THE ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCEen_US
dc.citation.spage423en_US
dc.citation.epage426en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000181801600067-
Appears in Collections:Conferences Paper