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dc.contributor.authorZan, HWen_US
dc.contributor.authorChen, SCen_US
dc.contributor.authorWang, SHen_US
dc.contributor.authorChang, CYen_US
dc.date.accessioned2014-12-08T15:26:12Z-
dc.date.available2014-12-08T15:26:12Z-
dc.date.issued2003en_US
dc.identifier.isbn0-7803-7999-3en_US
dc.identifier.urihttp://hdl.handle.net/11536/18597-
dc.description.abstractIn this paper, the substrate current of polycrystalline silicon thin-film transistors was measured and investigated the first time. With typical T-gate pattered structure, an abnormal high substrate current was found while devices were operated under high gate voltage. This is generated from the parasitic tunnelling current between the n+ inversion region and the p+ body region. Under lower gate voltage, substrate current generated from impact ionization effect is also observed and characterized. After extracting fitting parameters from the device characteristics, a simple physically-based model was established and compared with the measured results. A plausible grain boundary scattering effect was included in the proposed model. Good agreements were found through a wide range of gate bias and various drain bias, verifying the validity of this unified model.en_US
dc.language.isoen_USen_US
dc.titleAnomalous substrate current in polycrystalline silicon thin-film transistorsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalESSDERC 2003: PROCEEDINGS OF THE 33RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCEen_US
dc.citation.spage469en_US
dc.citation.epage472en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000189004800114-
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