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dc.contributor.authorChen, MJen_US
dc.contributor.authorHuang, HTen_US
dc.contributor.authorHuang, KCen_US
dc.contributor.authorChen, PNen_US
dc.contributor.authorChang, CSen_US
dc.contributor.authorDiaz, CHen_US
dc.date.accessioned2014-12-08T15:26:27Z-
dc.date.available2014-12-08T15:26:27Z-
dc.date.issued2002en_US
dc.identifier.isbn0-7803-7462-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/18772-
dc.description.abstractThe ratio of the mean-free-path to the critical length near the low-field source is key to channel backscattering characteristics in nanoFETs. To extract it, we perform temperature experiment from -40 degreesC to 75 degreesC on 17 Angstrom thick gate oxide MOSFETs with varying mask gate lengths down to 75 nm. In this paper we report that once the saturation drain current is measured against temperature, the mean-free-path lambda with respect to the critical length l can readily be assessed at pecific temperature. Dependencies on gate length, drain voltage, and gate voltage are then established that further enable nanoFETs scaling projections. The temperature dependent version of existing backscattering model is derived in this work.en_US
dc.language.isoen_USen_US
dc.titleTemperature dependent channel backscattering coefficients in nanoscale MOSFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalINTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGESTen_US
dc.citation.spage39en_US
dc.citation.epage42en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000185143400008-
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