Mismatch analysis of TAB-on-Glass connection with ACF

Abstract

Mismatch between outer lead bonds (OLBs) of a tape automated bonding (TAB) and a glass panel during fabrication is studied using the finite element method. A two-dimensional finite element model for the TAB-on Glass (TOG) connector is presented for determining the deformation of the connector. The deformation of the TOG connector induced by residual thermal stresses are determined via a two-stage approach. At the first stage, the TOG connector is under heat and pressure. The anisotropic conductive film (ACF) in-between the TAB and glass panel is assumed to be in a melting condition so that both TAB and glass panel can expand freely. At the second stage, the connector is cooled down to room temperature and the ACF becomes solidified. The deformations of the connector at the two stages are determined in the finite element analysis in which the temperature dependence of material properties is considered. Effects of particular parameters on the mismatch between the OLBs are studied by means of a number of numerical examples. A method for compensation design of the lead locations of the OLBs is proposed. It has been shown that the compensation design can produce results that will avoid the occurrence of unwanted mismatch.