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dc.contributor.authorKuo, CTen_US
dc.contributor.authorWu, JYen_US
dc.contributor.authorChou, SLen_US
dc.date.accessioned2014-12-08T15:27:02Z-
dc.date.available2014-12-08T15:27:02Z-
dc.date.issued2000en_US
dc.identifier.isbn0-8194-3699-2en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/19247-
dc.identifier.urihttp://dx.doi.org/10.1117/12.375453en_US
dc.description.abstractDiamond films deposited on various substrates were characterized nondestructively by Raman spectroscopy and X-ray diffraction (XRD) to evaluate their stress states and film quality. The X-ray diffraction method is further divided into two methods, i.e., the low incident beam angle X-ray diffraction (LIBAD), and Clemens-Bain method for the textured films. The whole-pattem-fitting structure refinement method, or called "Rietveld method" was adapted in XRD method to improve its accuracy. The film adhesion, film morphology and film structures including its non-diamond carbon content, crystal size, texture coefficient, film thickness and surface roughness were also examined. The correlations between structure and residual stress of the films on various substrates and under various deposition and pretreatment conditions were analyzed. The feasibility of nondestructive evaluation the Blm quality and stress states, and the origins of the residual stress of the films were discussed.en_US
dc.language.isoen_USen_US
dc.subjectnondestructive testingen_US
dc.subjectdiamond filmsen_US
dc.subjectRaman spectroscopyen_US
dc.subjectX-ray diffractionen_US
dc.subjectRietvelt analysisen_US
dc.subjectresidual stressen_US
dc.subjecttextured filmsen_US
dc.titleNondestructive characterization of the film quality and stress states in diamond films on various substratesen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1117/12.375453en_US
dc.identifier.journalTHIRD INTERNATIONAL WORKSHOP ON NONDESTRUCTIVE TESTING AND COMPUTER SIMULATIONS IN SCIENCE AND ENGINEERINGen_US
dc.citation.volume4064en_US
dc.citation.spage345en_US
dc.citation.epage350en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000086473700050-
Appears in Collections:Conferences Paper


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